Applied Sciences & Engineering Engineering & TechnologyENLec 33: Bistable Nematic DisplaysProf. Debabrata SikdarAugust 19, 2026 31 min★ ★ ★ ★ ☆ 4/5Bistable NematicLCDDisplay Technology
Applied Sciences & Engineering Engineering & TechnologyENThis Could End The RAM CrisisAnastasi In TechAugust 18, 2026 20 min★ ★ ★ ★ ☆ 4/5RAMHBMSemiconductors
Applied Sciences & Engineering Engineering & TechnologyENLec 35: Bistable Cholesteric Reflective Displays and Drive Schemes (Part-2)Prof. Debabrata SikdarAugust 18, 2026 32 min★ ★ ★ ★ ☆ 4/5Bistable CholestericReflective DisplaysDrive Schemes
Applied Sciences & Engineering Engineering & TechnologyENLec 34: Bistable Cholesteric Reflective Displays and Drive Schemes (Part-1)Prof. Debabrata SikdarAugust 18, 2026 31 min★ ★ ★ ★ ☆ 4/5Bistable DisplaysCholesteric Liquid CrystalsReflective Displays
Applied Sciences & Engineering Engineering & TechnologyENLec 32: Bistable Ferroelectric LCDs and Drive SchemeProf. Debabrata SikdarAugust 18, 2026 28 min★ ★ ★ ★ ☆ 4/5Ferroelectric LCDBistable DisplayPassive Matrix
Applied Sciences & Engineering Engineering & TechnologyENLec 31: Active Matrix DisplaysProf. Debabrata SikdarAugust 18, 2026 29 min★ ★ ★ ★ ☆ 4/5TFTLCDActive Matrix
Applied Sciences & Engineering Engineering & TechnologyENLec 30: LCD Matrices & Drive Schemes-IIProf. Debabrata SikdarAugust 12, 2026 28 min★ ★ ★ ★ ☆ 4/5LCDPassive MatrixDrive Schemes
Applied Sciences & Engineering Engineering & TechnologyENLec 29: LCD Matrices & Drive Schemes-IProf. Debabrata SikdarAugust 12, 2026 27 min★ ★ ★ ★ ☆ 4/5LCDDisplay TechnologyPassive Matrix
Applied Sciences & Engineering Engineering & TechnologyENLec 28: Phase Retardation LCDs & Cell-Gap DesignProf. Debabrata SikdarAugust 12, 2026 41 min★ ★ ★ ★ ☆ 4/5LCDPhase RetardationCell-Gap
Applied Sciences & Engineering Engineering & TechnologyENLec 27: Classification of Transflective LCDs (Part-B)Prof. Debabrata SikdarAugust 12, 2026 31 min★ ★ ★ ★ ☆ 4/5Transflective LCDLiquid CrystalDisplay Technology
Applied Sciences & Engineering Engineering & TechnologyENLec 27: Classification of Transflective LCDs (Part-A)Prof. Debabrata SikdarAugust 12, 2026 27 min★ ★ ★ ★ ☆ 4/5Transflective LCDGuest-Host EffectCholesteric Liquid Crystal
Applied Sciences & Engineering Engineering & TechnologyENLec 25: Introduction to Reflective LCDsProf. Debabrata SikdarAugust 7, 2026 34 min★ ★ ★ ★ ☆ 4/5Reflective LCDTransflective LCDDisplay Technology
Applied Sciences & Engineering Engineering & TechnologyENLec 24: Multi - Domain VA & OBC ModeProf. Debabrata SikdarAugust 7, 2026 35 min★ ★ ★ ★ ☆ 4/5LCDMVAOCB
Applied Sciences & Engineering Engineering & TechnologyENLec 23: Vertical Alignment Mode: Dynamics & OverdriveProf. Debabrata SikdarAugust 7, 2026 33 min★ ★ ★ ★ ☆ 4/5Vertical AlignmentLiquid Crystal DisplaysResponse Time
Applied Sciences & Engineering Engineering & TechnologyENLec 22: In - Plane switching ModeProf. Debabrata SikdarAugust 7, 2026 35 min★ ★ ★ ★ ☆ 4/5LCDIn-Plane SwitchingFringe Field Switching
Applied Sciences & Engineering Engineering & TechnologyENLec 21: Transmissive Liquid Crystal DisplaysProf. Debabrata SikdarAugust 7, 2026 23 min★ ★ ★ ★ ☆ 4/5LCDTwisted NematicDisplay Technology
Applied Sciences & Engineering Engineering & TechnologyENChina Just Built What ASML Feared MostAnastasi In TechJuly 27, 2026 18 min★ ★ ★ ★ ☆ 4/5EUV LithographySemiconductorsChina
Applied Sciences & Engineering Engineering & TechnologyENWorld's First 0.7 Nanometer MicrochipAnastasi In TechJuly 16, 2026 13 min★ ★ ★ ★ ☆ 4/5SemiconductorsNanotechnologyChip Manufacturing
Applied Sciences & Engineering Engineering & TechnologyENJosephson Junction and Superconducting Quantum Circuit Fabrication ProcessHiu-Yung WongJuly 9, 2026 48 min★ ★ ★ ★ ☆ 4/5Josephson JunctionSuperconducting QubitFabrication
Applied Sciences & Engineering Engineering & TechnologyEN#55: CHASSIS - Europäische Chiplet-Initiative, Emissionen in der Halbleiterproduktion, ALLOS Semi...Julia Nschner and Frank BösenbergJuly 4, 2026 30 min★ ★ ★ ★ ☆ 4/5SemiconductorsChipletEmissions
Applied Sciences & Engineering Engineering & TechnologyEN#43: Neue Halbleiterkrise? Nexperia Updates; Brains on Silicon - Review; Neue Chips: Europa von Axelera AI und Maverick 2 von NextSiliconJulian Nitchner and Frank BösenbergJuly 4, 2026 32 min★ ★ ★ ★ ☆ 4/5SemiconductorsNexperiaAI Chips
Applied Sciences & Engineering Engineering & TechnologyENSilicon Is Over. Meet Its SuccessorAnastasi In TechJune 29, 2026 18 min★ ★ ★ ★ ☆ 4/5Semiconductors2D MaterialsMolybdenum Disulfide
Applied Sciences & Engineering Engineering & TechnologyENThe Thermodynamic AI ChipThomas AhleJune 28, 2026 63 min★ ★ ★ ★ ☆ 4/5Thermodynamic ComputingChip DesignFormal Verification
Applied Sciences & Engineering Engineering & TechnologyENThe Lab That Decides Which Chip Technologies the World Actually BuildsSalah NasriJune 17, 2026 37 min★ ★ ★ ★ ☆ 4/5SemiconductorsCMOS 2.0Photonics
Applied Sciences & Engineering Engineering & TechnologyENChina Just Built What TSMC Said Was ImpossibleAnastasi In TechJune 16, 2026 17 min★ ★ ★ ★ ☆ 4/5HuaweiSemiconductorsChip Design
Applied Sciences & Engineering Engineering & TechnologyENThey Just Shrunk AI Data Center by 10,000xAnastasi In TechJune 8, 2026 19 min★ ★ ★ ★ ☆ 4/5SuperconductorsAI Data CentersIMEC
Formal & Physical Sciences Engineering & TechnologyENBJT Part2: Base width modulation, High Level Injection, Breakdown, Circuit Models | 2026 L13Prof. Tian-Li Wu (陽明交大電子吳添立)June 3, 2026 63 min★ ★ ★ ★ ☆ 4/5BJTSemiconductor PhysicsEarly Effect
Formal & Physical Sciences Engineering & TechnologyENAdvanced CMOS Scaling: FinFET to GAA and CFET | 2026 L14Prof. Tian-Li WuJune 3, 2026 75 min★ ★ ★ ★ ☆ 4/5CMOSFinFETGAA
Formal & Physical Sciences Engineering & TechnologyENBJT Part1: NPN Operation, Minority Carrier Distribution & What Controls Current Gain | 2026 L12Prof. Tian-Li WuJune 1, 2026 141 min★ ★ ★ ★ ☆ 4/5BJTSemiconductor PhysicsTransistor
Applied Sciences & Engineering Engineering & TechnologyENTearing Apart An X-Ray Machine - Nuclear Engineer Reacts to NileRedT. Folse NuclearMay 20, 2026 20 min★ ★ ★ ★ ☆ 4/5X-RayNuclear EngineeringRadiation Safety
Formal & Physical Sciences Engineering & TechnologyENMOSFET Part 2: Basic Operations and Key Advanced Concepts| 2026 L11Prof. Tian-Li WuMay 18, 2026 170 min★ ★ ★ ★ ☆ 4/5MOSFETSemiconductor PhysicsDevice Operation
Applied Sciences & Engineering Engineering & TechnologyENCette nouvelle technologie pourrait tuer TSMC et ASML.Vision IAMay 16, 2026 21 min★ ★ ★ ★ ☆ 4/5SemiconductorsTSMCIntel
Applied Sciences & Engineering Engineering & TechnologyENThe Terrifying Truth About TSMC's New ChipsAnastasi In TechMay 11, 2026 17 min★ ★ ★ ★ ☆ 4/5TSMCIntelSemiconductors
Formal & Physical Sciences Engineering & TechnologyENMOSFET Part 1: Band Diagrams, Threshold Voltage, C–V | 2026 L10Prof. Tian-Li WuMay 11, 2026 126 min★ ★ ★ ★ ☆ 4/5MOSFETSemiconductor PhysicsBand Diagram
Formal & Physical Sciences Engineering & TechnologyENDiode Current, Contacts & the Road to MOSFET: PN Current, Ohmic vs Schottky & MOS Capacitor | 2026L9Prof. Tian-Li WuMay 4, 2026 152 min★ ★ ★ ★ ☆ 4/5Semiconductor PhysicsPN JunctionSchottky Barrier
Applied Sciences & Engineering Engineering & TechnologyENThe Breakthrough Terrifying ASMLAnastasi In TechApril 27, 2026 13 min★ ★ ★ ★ ☆ 4/5EUV LithographyDirected Self-AssemblySemiconductor Manufacturing
Applied Sciences & Engineering Engineering & TechnologyENSystem-in-Package ChallengesSemiconductor EngineeringApril 23, 2026 20 min★ ★ ★ ★ ☆ 4/5System-in-PackageChipletsAdvanced Packaging
Applied Sciences & Engineering Engineering & TechnologyENNext Step in Semiconductor at PurdueSemiconductors @ PurdueApril 21, 2026 50 min★ ★ ★ ★ ☆ 4/5SemiconductorsEducationPurdue
Formal & Physical Sciences Engineering & TechnologyENPN Junction : Built-In Potential, Depletion Width, Reverse Bias, Breakdown, Diode Current | 2026L8Prof. Tian-Li WuApril 20, 2026 162 min★ ★ ★ ★ ☆ 4/5PN JunctionSemiconductor PhysicsDepletion Region
Applied Sciences & Engineering Engineering & TechnologyENWhy More CPUs Are Needed In Data CentersSemiconductor EngineeringApril 15, 2026 20 min★ ★ ★ ★ ☆ 4/5CPUsAI Data CentersAgentic AI