Ultrashort-pulse lasers in chip manufacturing and packaging

Item: Ultrashort-pulse lasers in chip manufacturing and packaging
Rating: 4
Author: PostSingularity Institute

by Dr. Gediminas Račiukaitis

Applied Sciences & Engineering Engineering & Technology TTBApplied optics TTBLLaser technology and holography

🎙 Dr. Gediminas Račiukaitis 👥 5K 📅 January 9, 2026 ⏱ 12 min 👁 56 📄 expert opinion 🧭 2026-08-16

Available in: English (current) Français

Keywords

ultrashort-pulse laserschip packaginglaser direct writingselective surface activationthrough-glass vias

Summary

Dr. Gediminas Račiukaitis from the Center for Physical Sciences and Technology (FTMC) in Lithuania presents an overview of how ultrashort-pulse lasers are applied in semiconductor manufacturing and packaging. He introduces the Lithuanian laser ecosystem, highlighting its strengths in material processing. The talk covers various applications such as dicing, slicing, and mask cutting, especially for new materials like silicon carbide and diamond. A significant portion is dedicated to advanced packaging, including through-silicon vias, through-glass vias, and fan-out packaging, where lasers can simplify processes. He details a specific technology developed at FTMC called selective surface activation (SAL), which uses ultrashort-pulse lasers to write circuits on dielectric surfaces, followed by electroless plating, enabling fine traces and high adhesion on various substrates. Examples include flexible PET substrates, glass for mini-LED displays, and ceramics for heterogeneous integration. The talk also discusses laser drilling of through-glass vias with gigahertz burst lasers, which can achieve high throughput without etching. The speaker emphasizes the flexibility, speed, and reduced process steps offered by these laser-based methods, positioning them as promising for future chip integration. The presentation concludes with a vision of combining semiconductor education with laser expertise to address industry challenges.

192 words

Critical Evaluation

Value of the Information & Strength of the Argument

The talk provides valuable insights into the practical applications of ultrashort-pulse lasers in semiconductor packaging, a niche but increasingly important area. The speaker demonstrates the technology with concrete examples, such as the SAL process and its use in mini-LED displays, which adds credibility. The argumentation is logical, moving from general applications to specific technologies and their benefits. However, the presentation is more of an overview than a deep dive, and the speaker does not provide quantitative comparisons with existing methods or discuss limitations in detail. The value lies in the expert perspective and the demonstration of a working technology, but the argumentation could be strengthened with more data and comparative analysis.

Scientific Rigor, Source Quality, Title Accuracy

The speaker is a recognized expert in laser technology, and the content is based on his research and industrial collaborations. However, the presentation does not cite specific sources or references, relying instead on the speaker’s authority and examples from his work. The title accurately reflects the content, which is focused on the application of ultrashort-pulse lasers in chip manufacturing and packaging. The talk is a conference presentation, so it is not a peer-reviewed publication, but it offers a credible expert opinion. The lack of citations is a limitation for verifying the claims, but the practical demonstrations and the speaker’s background lend some reliability.

229 words

Title / Content Match

The title accurately reflects the content, which focuses on the use of ultrashort-pulse lasers in semiconductor manufacturing and packaging.

Quality & Reliability

7/10

The speaker is a leading expert in laser technology, and the content is based on his research and industrial applications. However, the presentation is a conference talk with limited depth and no citations or references to specific studies.

Key Moments

Markers derived by PSI from the transcript: the creator did not define chapters.

Contribution & Novelties

The talk presents a novel approach to chip packaging using ultrashort-pulse lasers, specifically the SAL technology developed at FTMC. This method offers a maskless, direct-write alternative to traditional lithography, potentially reducing process steps and enabling fine interconnects on various substrates. The presentation also highlights the use of gigahertz burst lasers for through-glass vias, which could improve throughput and reduce etching steps. These innovations are relevant for advanced packaging and heterogeneous integration.

Pour aller plus loin :

Selective laser activation for electroless plating — Background on the plating process used in SAL.
Through-glass via technology — Overview of TGV technology and its applications.
Ultrafast laser processing — General principles of ultrashort-pulse laser material processing.

113 words

Radar Profile

The radar profile shows a balanced performance across all dimensions, with slightly higher scores in information quantity and quality, reflecting the expert's comprehensive overview. The technical level is moderate, suitable for a general technical audience, and the reliability is supported by the speaker's expertise, though limited by the lack of citations.

Reliability 7/10